Senthil, J. and Praveenkumar, B. and Saravanan, M. and Selvababu, B. (2022) Optimization of process parameters in RTV gluing in PCBA. In: UNSPECIFIED.
Full text not available from this repository.Abstract
In general, for a wide variety of applications RTV coating is done on PCBAs to improve the resistance to weathering and difficult environments. RTV has a wide range of constant properties of very good electrically insulation, UV resistance, Radiation resistance, very good frequency, temperature, chemical resistance, fire retardant in the application of RTV on PCBAs it was observed several quality issues are occurring. To study the response parameter during RTV application silicone rubber in vulcanization environment with different nozzle diameter (0.06mm, 0.51mm, 1.65mm) nozzle pressure (0.5bar, 1 bar, 1.5 bar), viscosity (34.4 poise, 35 poise, 36 poise) it is found that different parameter has effects on response parameter bubbles, improper thickness and more cycle time. All these parameter issues could be solved by conducting DOE. From the conducted experiment result it is found that the optimized combination of parameters to achieve fewer bubbles, target thickness, and within the less time achieved. © 2022 Elsevier B.V., All rights reserved.
| Item Type: | Conference or Workshop Item (Paper) |
|---|---|
| Subjects: | Engineering > Civil and Structural Engineering |
| Divisions: | Engineering and Technology > Aarupadai Veedu Institute of Technology, Chennai > Mechanical Engineering |
| Depositing User: | Unnamed user with email techsupport@mosys.org |
| Last Modified: | 02 Dec 2025 09:06 |
| URI: | https://vmuir.mosys.org/id/eprint/2670 |
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